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The first 3D and triple-level cell (TLC) SSDs by Micron

  • June 3, 2016
  • 4 min read
Online Marketing Manager at StarWind. In touch with virtualization world, may know stuff you are interested in.
Online Marketing Manager at StarWind. In touch with virtualization world, may know stuff you are interested in.

Micron has announced its first 3D NAND SSDs, triple-level cell (3bits/cell) 1100 and 2200 products.

The 1100 is a 6Gbit/s SATA product coming in 2.5-inch and M.2 SATA formats in 256GB, 512GB, 1024GB and 2048GB (2.5-inch only) capacity points, it uses 32-layer TLC NAND with 384Gb dice.Micron 1100 3D NAND SSD in the M.2 form factor

Micron 1100 3D NAND SSD in the M.2 form factor

1100’s speeds and feeds;

  • To 92,000 random read 4K IOPS
  • To 83,000 random write 4K IOPS
  • 530MB/sec sequential read
  • 500MB/sec sequential write
  • Latency – read/write 85μs/40μs typical FOB
  • Endurance – 120TB written – 256GB, 240TBW – 512GB, 400TBW 1 & 2TB (=224GB/day for 5 years)

For reference, here are the characteristics of Micron’s M600, using 16nm process MLC flash with 128Gb dice:

  • To 100,000 random read 4K IOPS
  • To 88,000 random write 4K IOPS
  • 560MB/sec sequential read
  • 510MB/sec sequential write
  • Endurance – 100TB written – 128GB, 2000TBW – 256GB, 300TBW – 512GB, 400TBW 1TB

Considering the fact that TLC has less endurance than MLC NAND as well as slower performance, 1100 shows a significant result being not that far behind M600.

1100 has an extreme low power mode called DEVSLP, with less than 2 mW needed for 256 and 512 GB products in this mode, whereas 1TB needs 4mW.

Like the M600, the 1100 has dynamic write acceleration. Its uncorrectable bit error rate (UBER) is <1 sector per 1015  bits read. The product features encryption and secure erase capability and a 1.5 million hours MTBF rating.

This is the review of an article.

Source: theregister.co.uk

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Alex Bykovskyi
Alex Bykovskyi StarWind Virtual HCI Appliance Product Manager
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